BGA reballing, NAND, PMIC, micro-soldering — the highest-tier of phone repair. Same standard taught at our PPTM CUP-hosting academy.
Motherboard / chip-level repair is the highest-skill tier of phone repair, and it's exactly the discipline that PPTM CUP exists to celebrate. WikiMobi Glontech's senior team is internationally recognised in this field — we don't just repair boards, we train other technicians how to.
Hot-air rework stations, JBC microsoldering stations, BGA reballing stencils, microscopes (Mantis-class), bench DC power supplies for current-draw analysis, infrared thermography for short-isolation, and licensed schematic software (ZXW, WUXINJI). The same toolkit you'd see at any top-tier repair lab in Shenzhen.